Laird Technologies EMI Việt Nam | Laird Technologies EMI 67BCG2003201508R00

67BCG2003201508R00

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Manufacturer

Laird Technologies EMI

Product description

RFI FINGERSTOCK BECU GOLD SOLDER

Manufacturer Product Number

67BCG2003201508R00

Detailed description

Datasheet

https://www.laird.com/document/datasheet/67bcg2003201508r00-drawing Datasheet

Product Attributes

Select all 		Type Description
Manufacturer Laird Technologies EMI
Series BCG
Package Bulk
Part Status Active
Type Fingerstock
Shape -
Width 0.078" (2.00mm)
Length 0.126" (3.20mm)
Height 0.059" (1.50mm)
Material Beryllium Copper
Plating Gold
Attachment Method Solder

Environmental and Export Classifications

ATTRIBUTE DESCRIPTION
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
REACH Status REACH Unknown
ECCN EAR99
HTSUS 8529.90.9800
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Bulk

QUANTITY UNIT PRICE EXT PRICE
Box Icon 1 20,251 20,251
Package Icon Manufacturers Standard Package

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