Laird Technologies EMI Việt Nam | Laird Technologies EMI 67BCG2004705710R00
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Manufacturer
Laird Technologies EMI
Product description
RFI FINGERSTOCK BECU GOLD SOLDER
Manufacturer Product Number
67BCG2004705710R00
Detailed description
Datasheet
Datasheet Product Attributes
|
|
Type | Description |
|---|---|---|
| Manufacturer | Laird Technologies EMI |
|
| Series | BCG |
|
| Package | Bulk |
|
| Part Status | Active |
|
| Type | Fingerstock |
|
| Shape | - |
|
| Width | 0.079" (2.00mm) |
|
| Length | 0.185" (4.70mm) |
|
| Height | 0.224" (5.70mm) |
|
| Material | Beryllium Copper |
|
| Plating | Gold |
|
| Plating - Thickness | - |
|
| Attachment Method | Solder |
|
| Operating Temperature | - |
|
Environmental and Export Classifications
| ATTRIBUTE | DESCRIPTION |
|---|---|
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| REACH Status | REACH Unaffected |
| ECCN | EAR99 |
| HTSUS | 8529.90.9800 |
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