Laird Technologies EMI Việt Nam | Laird Technologies EMI 67BXG2503504008R00

67BXG2503504008R00

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Manufacturer

Laird Technologies EMI

Product description

RFI FINGERSTOCK BECU GOLD SOLDER

Manufacturer Product Number

67BXG2503504008R00

Detailed description

Datasheet

https://www.laird.com/document/datasheet/67bxg2503504008r00-drawing Datasheet

Product Attributes

Select all 		Type Description
Manufacturer Laird Technologies EMI
Series BXG
Package Bulk
Part Status Active
Type Fingerstock
Shape -
Width 0.098" (2.50mm)
Length 0.138" (3.50mm)
Height 0.157" (4.00mm)
Material Beryllium Copper
Plating Gold
Plating - Thickness -
Attachment Method Solder
Operating Temperature -

Environmental and Export Classifications

ATTRIBUTE DESCRIPTION
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
REACH Status REACH Unknown
ECCN EAR99
HTSUS 8529.90.9800
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Bulk

QUANTITY UNIT PRICE EXT PRICE
Box Icon 1 30,600 30,600
Package Icon Manufacturers Standard Package

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