Laird Technologies EMI Việt Nam | Laird Technologies EMI 67SLG060080070PI00
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Manufacturer
Laird Technologies EMI
Product description
RFI FILM OVER FOAM PU SOLDER
Manufacturer Product Number
67SLG060080070PI00
Detailed description
Datasheet
Datasheet Product Attributes
|
|
Type | Description |
|---|---|---|
| Manufacturer | Laird Technologies EMI |
|
| Series | SMD Grounding Metallized |
|
| Package | Tape & Reel (TR) |
|
| Part Status | Active |
|
| Type | Film Over Foam |
|
| Shape | Rectangle |
|
| Width | 0.236" (6.00mm) |
|
| Length | 0.276" (7.00mm) |
|
| Height | 0.315" (8.00mm) |
|
| Material | Polyurethane Foam, Tin-Copper Polyester (SN/CU) |
|
| Plating | - |
|
| Plating - Thickness | - |
|
| Attachment Method | Solder |
|
| Operating Temperature | -40°C ~ 70°C |
|
Environmental and Export Classifications
| ATTRIBUTE | DESCRIPTION |
|---|---|
| RoHS Status | RoHS Compliant |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| REACH Status | REACH Unknown |
| ECCN | EAR99 |
| HTSUS | 8536.90.4000 |
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