Laird Technologies EMI Việt Nam | Laird Technologies EMI 67SLH060100050PI00
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Manufacturer
Laird Technologies EMI
Product description
RFI FILM OVER FOAM PU SOLDER
Manufacturer Product Number
67SLH060100050PI00
Detailed description
Datasheet
Datasheet Product Attributes
|
|
Type | Description |
|---|---|---|
| Manufacturer | Laird Technologies EMI |
|
| Series | SMD Grounding Metallized |
|
| Package | Tape & Reel (TR) |
|
| Part Status | Active |
|
| Type | Film Over Foam |
|
| Shape | Hourglass |
|
| Width | 0.236" (6.00mm) |
|
| Length | 0.197" (5.00mm) |
|
| Height | 0.394" (10.00mm) |
|
| Material | Polyurethane Foam, Tin-Copper Polyester (SN/CU) |
|
| Plating | - |
|
| Plating - Thickness | - |
|
| Attachment Method | Solder |
|
| Operating Temperature | -40°C ~ 70°C |
|
Environmental and Export Classifications
| ATTRIBUTE | DESCRIPTION |
|---|---|
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| REACH Status | REACH not applicable |
| ECCN | EAR99 |
| HTSUS | 8536.90.4000 |
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