Canfield Technologies Việt Nam | Canfield Technologies CCBLF22701031P

CCBLF22701031P

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Manufacturer

Canfield Technologies

Product description

BLF 227 NO CLEAN FLUX 1 LB. 031D

Manufacturer Product Number

CCBLF22701031P

Detailed description

Lead Free No-Clean Wire Solder BLF 227 (99.17Sn/.8Cu/.03Ni) 20 AWG, 22 SWG Spool, 1 lb (453.59g)

Product Attributes

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Type Description
Manufacturer Canfield Technologies
Series -
Package Spool
Part Status Active
Type Wire Solder
Composition BLF 227 (99.17Sn/.8Cu/.03Ni)
Diameter 0.031" (0.79mm)
Melting Point 440°F (227°C)
Flux Type No-Clean
Wire Gauge 20 AWG, 22 SWG
Process Lead Free
Form Spool, 1 lb (453.59g)
Shelf Life 24 Months
Shelf Life Start Date of Manufacture
Storage/Refrigeration Temperature 50°F ~ 104°F (10°C ~ 40°C)

Environmental and Export Classifications

ATTRIBUTE DESCRIPTION
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN
HTSUS

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Spool

QUANTITY UNIT PRICE EXT PRICE
Box Icon 1 2,651,400 2,651,400
Package Icon Manufacturers Standard Package