Bergquist Việt Nam | Bergquist HF115AC-0.0055-AC-58

HF115AC-0.0055-AC-58

Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

Mã digikey

BER168-ND

Manufacturer

Bergquist

Product description

THERM PAD 19.05MMX12.7MM W/ADH

Manufacturer Product Number

HF115AC-0.0055-AC-58

Manufacturer Standard Lead Time

10 Weeks

Detailed description

Thermal Pad Gray 19.05mm x 12.70mm Rectangular Adhesive - One Side

Datasheet

https://datasheets.tdx.henkel.com/BERGQUIST-HI-FLOW-THF-800AC-en_GL.pdf Datasheet

Product Attributes

Select all
Type Description
Manufacturer Bergquist
Series Hi-Flow® 115-AC
Package Bulk
Part Status Active
Usage TO-220
Type Pad, Sheet
Shape Rectangular
Outline 19.05mm x 12.70mm
Thickness 0.0055" (0.140mm)
Material Phase Change Compound
Adhesive Adhesive - One Side
Backing, Carrier Fiberglass
Color Gray
Thermal Resistivity 0.35u00b0C/W
Thermal Conductivity 0.8W/m-K
Similar

Documents and Media

RESOURCE TYPE Link
Datasheet https://datasheets.tdx.henkel.com/BERGQUIST-HI-FLOW-THF-800AC-en_GL.pdf Datasheet
Image -
Video -

Environmental and Export Classifications

ATTRIBUTE DESCRIPTION
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unknown
ECCN EAR99
HTSUS 3919.90.5060

Stock

Factory stock:

-

Can ship immediately

Bulk

QUANTITY UNIT PRICE EXT PRICE
Box Icon 1 46,351 46,351
Package Icon Manufacturers Standard Package