Chip Quik Inc. Việt Nam | Chip Quik Inc. JET551SNL30T5

JET551SNL30T5

Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

Mã digikey

315-JET551SNL30T5-ND

Manufacturer

Chip Quik Inc.

Product description

JET PRINTING SOLDER PASTE SN96.5

Manufacturer Product Number

JET551SNL30T5

Manufacturer Standard Lead Time

4 Weeks

Detailed description

No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 3.53 oz (100g)

Datasheet

http://www.chipquik.com/datasheets/JET551SNL30T5.pdf Datasheet

Product Attributes

Select all 		Type Description
Manufacturer Chip Quik Inc.
Series CHIPQUIK®
Package Bulk
Part Status Active
Type Solder Paste
Composition Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter -
Melting Point 423 ~ 428°F (217 ~ 220°C)
Flux Type No-Clean
Wire Gauge -
Process -
Form Syringe, 3.53 oz (100g)
Shelf Life 12 Months
Shelf Life Start Date of Manufacture
Storage/Refrigeration Temperature -
Similar

Documents and Media

RESOURCE TYPE Link
Datasheet http://www.chipquik.com/datasheets/JET551SNL30T5.pdf Datasheet
Image -
Video -

Environmental and Export Classifications

ATTRIBUTE DESCRIPTION
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN
HTSUS

Stock

Factory stock:

-

Can ship immediately

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Bulk

QUANTITY UNIT PRICE EXT PRICE
Box Icon 1 4,497,751 4,497,751
Package Icon Manufacturers Standard Package

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