Chip Quik Inc. Việt Nam | Chip Quik Inc. PA0170

PA0170

Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

Manufacturer

Chip Quik Inc.

Product description

MINI SOIC-8 EXP PAD TO DIP-8 SMT

Manufacturer Product Number

PA0170

Detailed description

Datasheet

http://www.chipquik.com/datasheets/PA0170.pdf Datasheet

Product Attributes

Select all 		Type Description
Manufacturer Chip Quik Inc.
Series Proto-Advantage
Package Bulk
Part Status Active
Proto Board Type SMD to DIP
Package Accepted MiniSOIC EP
Number of Positions 8
Pitch 0.026" (0.65mm)
Board Thickness 0.062" (1.57mm) 1/16"
Material FR4 Epoxy Glass
Size / Dimension 0.700" x 0.400" (17.78mm x 10.16mm)

Environmental and Export Classifications

ATTRIBUTE DESCRIPTION
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040
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Bulk

QUANTITY UNIT PRICE EXT PRICE
Box Icon 1 166,051 166,051
Package Icon Manufacturers Standard Package

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