Chip Quik Inc. Việt Nam | Chip Quik Inc. PA0196

PA0196

Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

Manufacturer

Chip Quik Inc.

Product description

TSSOP-64-EXP-PAD TO DIP-64 SMT

Manufacturer Product Number

PA0196

Detailed description

Datasheet

http://www.chipquik.com/datasheets/PA0196.pdf Datasheet

Product Attributes

Select all 		Type Description
Manufacturer Chip Quik Inc.
Series Proto-Advantage
Package Bulk
Part Status Active
Proto Board Type SMD to DIP
Package Accepted TSSOP
Number of Positions 64
Pitch 0.020" (0.50mm)
Board Thickness 0.062" (1.57mm) 1/16"
Material FR4 Epoxy Glass
Size / Dimension 1.000" x 3.200" (25.40mm x 81.28mm)

Environmental and Export Classifications

ATTRIBUTE DESCRIPTION
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040
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Bulk

QUANTITY UNIT PRICE EXT PRICE
Box Icon 1 499,051 499,051
Package Icon Manufacturers Standard Package

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