Chip Quik Inc. Việt Nam | Chip Quik Inc. SMD291AX250T3
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Manufacturer
Chip Quik Inc.
Product description
SOLDER PASTE SN63/PB37 250G
Manufacturer Product Number
SMD291AX250T3
Detailed description
Leaded No-Clean Solder Paste Sn63Pb37 (63/37) Jar, 8.8 oz (250g)
Datasheet
Datasheet Product Attributes
|
|
Type | Description |
|---|---|---|
| Manufacturer | Chip Quik Inc. |
|
| Series | - |
|
| Package | Bulk |
|
| Part Status | Active |
|
| Type | Solder Paste |
|
| Composition | Sn63Pb37 (63/37) |
|
| Diameter | - |
|
| Melting Point | 361°F (183°C) |
|
| Flux Type | No-Clean |
|
| Wire Gauge | - |
|
| Mesh Type | 3 |
|
| Process | Leaded |
|
| Form | Jar, 8.8 oz (250g) |
|
| Shelf Life | 12 Months |
|
| Shelf Life Start | Date of Manufacture |
|
| Storage/Refrigeration Temperature | 37°F ~ 46°F (3°C ~ 8°C) |
|
Environmental and Export Classifications
| ATTRIBUTE | DESCRIPTION |
|---|---|
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| REACH Status | REACH Unaffected |
| ECCN | EAR99 |
| HTSUS | 8311.30.6000 |
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