Chip Quik Inc. Việt Nam | Chip Quik Inc. SMD291SNL10T5
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Manufacturer
Chip Quik Inc.
Product description
SOLDER PASTE LF T5 10CC
Manufacturer Product Number
SMD291SNL10T5
Detailed description
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 1.23 oz (35g), 10cc
Datasheet
Product Attributes
|
Type | Description |
---|---|---|
Manufacturer | Chip Quik Inc. |
|
Series | - |
|
Package | Dispenser |
|
Part Status | Active |
|
Type | Solder Paste |
|
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
|
Diameter | - |
|
Melting Point | 423 ~ 428°F (217 ~ 220°C) |
|
Flux Type | No-Clean |
|
Wire Gauge | - |
|
Mesh Type | 5 |
|
Process | Lead Free |
|
Form | Syringe, 1.23 oz (35g), 10cc |
|
Shelf Life | 6 Months |
|
Shelf Life Start | Date of Manufacture |
|
Storage/Refrigeration Temperature | 37°F ~ 46°F (3°C ~ 8°C) |
|
Environmental and Export Classifications
ATTRIBUTE | DESCRIPTION |
---|---|
RoHS Status | ROHS3 Compliant |
Moisture Sensitivity Level (MSL) | Not Applicable |
REACH Status | REACH Unaffected |
ECCN | EAR99 |
HTSUS | 3810.10.0000 |
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