Chip Quik Inc. Việt Nam | Chip Quik Inc. SMD291SNL60T4

SMD291SNL60T4

Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

Mã digikey

SMD291SNL60T4-ND

Manufacturer

Chip Quik Inc.

Product description

SN96.5/AG3.0/CU0.5 2-PRT MIX 60G

Manufacturer Product Number

SMD291SNL60T4

Manufacturer Standard Lead Time

4 Weeks

Detailed description

Lead Free No-Clean Solder Paste, Two Part Mix Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 2.12 oz (60g)

Datasheet

http://www.chipquik.com/datasheets/SMD291SNL60T4.pdf Datasheet

Product Attributes

Select all
Type Description
Manufacturer Chip Quik Inc.
Series -
Package Bulk
Part Status Active
Type Solder Paste, Two Part Mix
Composition Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter -
Melting Point 423 ~ 428°F (217 ~ 220°C)
Flux Type No-Clean
Wire Gauge -
Mesh Type 4
Process Lead Free
Form Jar, 2.12 oz (60g)
Shelf Life 24 Months
Shelf Life Start Date of Manufacture
Storage/Refrigeration Temperature 37°F ~ 77°F (3°C ~ 25°C)
Similar

Documents and Media

RESOURCE TYPE Link
Datasheet http://www.chipquik.com/datasheets/SMD291SNL60T4.pdf Datasheet
Image -
Video https://www.digikey.com/api/videos/videoplayer/smallplayer/4607458108001 Video

Environmental and Export Classifications

ATTRIBUTE DESCRIPTION
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8311.30.6000

Stock

Factory stock:

-

Can ship immediately

Bulk

QUANTITY UNIT PRICE EXT PRICE
Box Icon 1 2,022,751 2,022,751
Package Icon Manufacturers Standard Package