Chip Quik Inc. Việt Nam | Chip Quik Inc. TS391LT250

TS391LT250

Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

Manufacturer

Chip Quik Inc.

Product description

THERMALLY STABLE SOLDER PASTE NO

Manufacturer Product Number

TS391LT250

Detailed description

Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 8.8 oz (250g)

Datasheet

http://www.chipquik.com/datasheets/TS391LT250.pdf Datasheet

Product Attributes

Select all 		Type Description
Manufacturer Chip Quik Inc.
Series -
Package Bulk
Part Status Active
Type Solder Paste
Composition Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter -
Melting Point 281°F (138°C)
Flux Type No-Clean
Wire Gauge -
Mesh Type 4
Process Lead Free
Form Jar, 8.8 oz (250g)
Shelf Life 12 Months
Shelf Life Start Date of Manufacture
Storage/Refrigeration Temperature 68°F ~ 77°F (20°C ~ 25°C)

Environmental and Export Classifications

ATTRIBUTE DESCRIPTION
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 3810.10.0000
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Bulk

QUANTITY UNIT PRICE EXT PRICE
Box Icon 1 3,822,751 3,822,751
Package Icon Manufacturers Standard Package

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