Chip Quik Inc. Việt Nam | Chip Quik Inc. TS991AX500T4

TS991AX500T4

Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

Mã digikey

315-TS991AX500T4-ND

Manufacturer

Chip Quik Inc.

Product description

SOLDER PASTE THERMALLY STABLE NC

Manufacturer Product Number

TS991AX500T4

Manufacturer Standard Lead Time

4 Weeks

Detailed description

Leaded No-Clean Solder Paste Sn63Pb37 (63/37) Jar, 17.64 oz (500g)

Datasheet

http://www.chipquik.com/datasheets/TS991AX500T4.pdf Datasheet

Product Attributes

Select all 		Type Description
Manufacturer Chip Quik Inc.
Series CHIPQUIK®
Package Bulk
Part Status Active
Type Solder Paste
Composition Sn63Pb37 (63/37)
Diameter -
Melting Point 361°F (183°C)
Flux Type No-Clean
Wire Gauge -
Mesh Type 4
Process Leaded
Form Jar, 17.64 oz (500g)
Shelf Life 12 Months
Shelf Life Start Date of Manufacture
Similar

Documents and Media

RESOURCE TYPE Link
Datasheet http://www.chipquik.com/datasheets/TS991AX500T4.pdf Datasheet
Image -
Video -

Environmental and Export Classifications

ATTRIBUTE DESCRIPTION
RoHS Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Affected
ECCN EAR99
HTSUS 3810.10.0000

Stock

Factory stock:

-

Can ship immediately

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Bulk

QUANTITY UNIT PRICE EXT PRICE
Box Icon 1 4,759,651 4,759,651
Package Icon Manufacturers Standard Package

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