Chip Quik Inc. Việt Nam | Chip Quik Inc. TS991SNL500T4

TS991SNL500T4

Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

Mã digikey

315-TS991SNL500T4-ND

Manufacturer

Chip Quik Inc.

Product description

SOLDER PASTE THERMALLY STABLE NC

Manufacturer Product Number

TS991SNL500T4

Manufacturer Standard Lead Time

4 Weeks

Detailed description

Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)

Datasheet

http://www.chipquik.com/datasheets/TS991SNL500T4.pdf Datasheet

Product Attributes

Select all 		Type Description
Manufacturer Chip Quik Inc.
Series CHIPQUIK®
Package Bulk
Part Status Active
Type Solder Paste
Composition Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter -
Melting Point 423°F (217°C)
Flux Type No-Clean
Wire Gauge -
Mesh Type 4
Process Lead Free
Form Jar, 17.64 oz (500g)
Shelf Life 12 Months
Shelf Life Start Date of Manufacture
Similar

Documents and Media

RESOURCE TYPE Link
Datasheet http://www.chipquik.com/datasheets/TS991SNL500T4.pdf Datasheet
Image -
Video -

Environmental and Export Classifications

ATTRIBUTE DESCRIPTION
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 3810.10.0000

Stock

Factory stock:

-

Can ship immediately

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Bulk

QUANTITY UNIT PRICE EXT PRICE
Box Icon 1 4,833,451 4,833,451
Package Icon Manufacturers Standard Package

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