Chip Quik Inc. Việt Nam | Chip Quik Inc. WS991SNL35T4

WS991SNL35T4

Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

Mã digikey

315-WS991SNL35T4-ND

Manufacturer

Chip Quik Inc.

Product description

THERMALLY STABLE SOLDER PASTE WS

Manufacturer Product Number

WS991SNL35T4

Manufacturer Standard Lead Time

4 Weeks

Detailed description

Water Soluble Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 1.23 oz (34.869g)

Datasheet

http://www.chipquik.com/datasheets/WS991SNL35T4.pdf Datasheet

Product Attributes

Select all 		Type Description
Manufacturer Chip Quik Inc.
Series CHIPQUIK®
Package Bulk
Part Status Active
Type Solder Paste
Composition Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter -
Melting Point 423°F (217°C)
Flux Type Water Soluble
Wire Gauge -
Mesh Type 4
Process -
Form Syringe, 1.23 oz (34.869g)
Shelf Life 12 Months
Shelf Life Start Date of Manufacture
Storage/Refrigeration Temperature 37°F ~ 77°F (3°C ~ 25°C)
Similar

Documents and Media

RESOURCE TYPE Link
Datasheet http://www.chipquik.com/datasheets/WS991SNL35T4.pdf Datasheet
Image -
Video -

Environmental and Export Classifications

ATTRIBUTE DESCRIPTION
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 3810.10.0000

Stock

Factory stock:

-

Can ship immediately

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Bulk

QUANTITY UNIT PRICE EXT PRICE
Box Icon 1 1,981,800 1,981,800
Package Icon Manufacturers Standard Package

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